As clear as daylight: innovative automation increases efficiency

Wafer production places high demands on the technology used, while the market demands maximum efficiency from manufacturers. The new, environmentally friendly diamond wire technology for wire saws doubles the cutting speed of saws. Siemens offers optimized automation concepts for high-performance ingot cutting machines. A key advantage is the ability to supply not only the automation components, but also the matching motors and drives. That's why Siemens is currently a market leader for the automation and supply of machines and plants for wafer production, including bricking machines, wire saws, wafer separation machines, and wafer cleaning machines.
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Wafer production places high demands on the technology used, while the market demands maximum efficiency from manufacturers. The new, environmentally friendly diamond wire technology for wire saws doubles the cutting speed of saws. Siemens offers optimized automation concepts for high-performance ingot cutting machines. A key advantage is the ability to supply not only the automation components, but also the matching motors and drives. That's why Siemens is currently a market leader for the automation and supply of machines and plants for wafer production, including bricking machines, wire saws, wafer separation machines, and wafer cleaning machines.